28 Dec
2021
28 Dec
'21
5:26 p.m.
EdgeSys'22 is open for submissions now: https://edgesys22.hotcrp.com/ The EdgeSys series have been gathering substantial community contributions, especially with high quality TPC, keynotes, panel and technical papers from US, Europe and Asia, including Google, Amazon, Microsoft, Apple, Facebook, Alibaba, Intel, IBM, Nokia, Ericsson, Samsung, Toyota, Telefónica, MPI, Helmholtz, MIT, Berkeley, Columbia, Yale, UCLA, CMU, Cambridge, Imperial, EPFL, TU Delft, TUM, Tsinghua, Peking and Fudan. Programme Committee and submission guideline: https://edge-sys.github.io/2022/committee.html https://edge-sys.github.io/2022/submission.html Look forward to submissions from RIPE! Aaron
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Aaron Ding