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December 2022

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SIGCOMM 2023 Call for Papers
by Aaron Ding 31 Dec '22

31 Dec '22

ACM SIGCOMM 2023 Call for Papers: https://conferences.sigcomm.org/sigcomm/2023/cfp.html * Call for Papers * The ACM SIGCOMM 2023 conference seeks papers describing significant research contributions or significant deployment experience in communication networks and networked systems. SIGCOMM takes a broad view of networking, and welcomes submissions on these topics, among others: - All types of computer networks, including mobile, wide-area, data center, embedded, home, and enterprise networks. - All types of wired and wireless technologies, including optics, radio, acoustic, and visible light-based communication. - All aspects of networks and networked systems, such as network architecture, packet-processing hardware and software, virtualization, mobility, resource management, performance, energy consumption, topology, robustness, security, diagnosis, verification, privacy, economics, evolution, and interactions with applications. - All parts of the network life cycle, including planning, designing, building, operating, troubleshooting, and migrations. - All approaches and techniques, including theory, analysis, experiments, and machine learning. SIGCOMM 2023 will accept submissions in three tracks: research, experience, and panel. Panel submissions are new this year. Strong research track submissions will significantly advance the state of the art in networking by, for instance, proposing and developing novel ideas or by rigorously evaluating or re-evaluating existing ideas. Strong experience track submissions will present key insights and takeaways found in the course of designing and executing deployments of existing networking techniques, especially in settings that most in the community cannot duplicate (for instance, for reasons of scale). Strong panel submissions will propose a topic and panel of speakers whose ideas and interactions will engage conference attendees. All submissions should discuss the limitations of their work. Survey and tutorial papers are out of scope and will not be reviewed. Research submissions must be anonymous (not revealing author names). Experience submissions must also be anonymous, but due to their nature, may reveal the name of the deploying organization or deployed system. The authorship of a panel submission may be anonymous, but the proposed panelists must be named in the body of the submission. While no author names can appear in a paper submitted for review, all authors must be listed in HotCRP before the submission deadline so reviewer conflicts are handled properly. At paper registration time, authors must explicitly indicate in the submission form if their paper is to be considered for the research, experience, or panel track. Each submission will only be considered for the one track identified at submission time. * Submissions * Submission site: https://sigcomm2023.hotcrp.com Submissions should be in two-column, 10-point format, and can be up to 12 pages in length with as many additional pages as necessary for references and optional appendices (up to 5 pages for panel submissions). Submissions and final papers may include appendices (following references, not counting against the 12 pages). Reviewers are not required to read appendices or consider them in their review. Authors should thus ensure that the core paper is complete and self-contained. For example, if the appendix provides details of a proof or experiment, the body should summarize the key result. Appendices may also include non-traditional material, such as videos, datasets, and code, all appropriately anonymized. The review process may involve multiple rounds of review. Papers that are not selected to proceed may receive early notification, including reviews. Accepted papers may be shepherded by a member of the program committee to ensure reviewer feedback is appropriately addressed. The shepherd will also review appendices and must approve their necessity. SIGCOMM 2023 plans to be an in-person event, and the authors of every accepted paper are expected to arrange for an in-person attendee to present the paper and answer questions. For accepted papers, the official publication date is the date the proceedings are made available in the ACM Digital Library. This date may be up to two weeks prior to the first day of the conference. The official publication date affects the deadline for any patent filings related to published work. (For those rare conferences whose proceedings are published in the ACM Digital Library after the conference is over, the official publication date remains the first day of the conference.) * Important Dates * Abstract registration deadline: Wednesday February 8, 2023 23:59 UTC Paper submission deadline: Wednesday February 15, 2023 23:59 UTC Paper acceptance notification: Saturday May 20, 2023 Conference: September 10 - 14, 2023 * TPC Chairs * If you have any questions do not hesitate to contact our TPC Chairs: dmaltz(a)microsoft.com kohler(a)seas.harvard.edu Aaron -- Director of CPI Lab & Associate Professor of Edge AI, TU Delft Scientific Director & Coordinator for EU Horizon SPATIAL Project Editorial Board for ACM Transactions on Internet of Things (TIOT) https://sk-alg.tbm.tudelft.nl/aaron/

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ISLPED 2023 Call for Papers
by Rehman, Semeen 23 Dec '22

23 Dec '22

[cid:b7175045-0ae5-4549-9fd0-7f861aafe13c] Thank you, Semeen Rehman ISLPED 2023 Publicity co-chair ====== Assist. Prof. Univ. Doz. Dr.-Ing. Semeen Rehman Institute of Computer Technology (ICT), Faculty of Electrical Engineering Vienna University of Technology (TU Wien)

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